Laminate FR4

You can find a detailed description of the laminate.

Laminates in TePro warehouse

Microwave material ROGERS

NOTE: To use ROGERS material in the production of circuit boards, please indicate this in the order form

Since Rogers material is significantly more expensive than standard FR4, we are forced to introduce an additional markup for boards manufactured using Rogers material. Working fields of used workpieces: 170 × 130; 270 × 180; 370 × 280; 570 × 380.

Metal based laminates

Visual representation of the material

Aluminum laminate ACCL 1060-1 with dielectric thermal conductivity 1 W/(m K)

Description

Aluminum laminate CS-AL88-AD2(AD5) with dielectric thermal conductivity 2(5) W/(m K)

Description

Prepreg

In production we use prepregs 2116, 7628 and 1080 grade A (highest) from ILM.

You can find a detailed description of prepregs.

Solder mask

Properties

You can find a detailed description of the solder mask.

Frequently asked questions and answers on laminates and prepregs

What is XPC?

What's the difference between FR1 and FR2?

What is FR2?

What is FR3?

What is FR4?

What is FR5?

What is CEM-1?

What is CEM-3?

What is G10?

How can laminates be replaced?

What are "prepregs"?

What does FR or CEM stand for?

Is FR4 really green?

Does the color of the logo mean anything?

Does logo orientation mean anything?

What is UV blocking laminate?

What laminates are suitable for plating through holes?

Is there an alternative for plating through holes?

What is "material thickness"?

What is: PF-CP-Cu? IEC-249? GFN?

What is CTI?

What does #7628 mean? What other numbers are there?

What is 94V-0, 94V-1, 94-HB?

Fiberglass laminate is used more often than other materials to make the base of a rigid board. Fiberglass laminate has good dielectric properties, mechanical strength and chemical resistance, durability and safety; fiberglass laminate can be used in conditions high humidity. Most important characteristics material - electrical insulating properties and the second most important characteristic is the glass transition temperature Tg, which limits the scope of application. Temperature of material transition from solid state into a plastic state - glass transition temperature. The higher the glass transition temperature of the resin, the lower the coefficient of linear expansion of the dielectric, which leads to the destruction of the board conductors. The glass transition temperature depends on the molecular weight of the resin molecules used in the manufacture of the material. The appearance and increase in elasticity occurs in a certain temperature range. The central value within this range is called the glass transition temperature. An increase in the glass transition temperature is possible with the improvement of fiberglass production technology.

Fiberglass is a material made by hot pressing of several layers of fiberglass impregnated with a binder - epoxy or phenol-formaldehyde resin. There are many brands available for various conditions operation. Developed different requirements to manufacturing technology. The ignition temperature of various grades of fiberglass is from 300 to 500 °C. STEF A common domestic brand of fiberglass laminate stands for epoxy-phenolic fiberglass laminate. STEF-1 differs from STEF only in its manufacturing technology, which makes it more suitable for mechanical processing. STEF-U has improved mechanical and electrical insulating properties compared to the STEF-1 brand.

A variety of this material is foil-coated fiberglass, used in the production of circuit boards.

foil material is the base material of the board, which has a conductive foil on one or both sides - a sheet of conductive material intended to form a conductive pattern on the board. The success of board production and the reliability of the manufactured device depend on the quality and parameters of the material used.

Foil fiberglass laminate has many brands. For the production of boards, domestic brands are used in accordance with GOST, produced by our manufacturers: SF, SONF-U, STF, STNF, SNF, DFM-59, SFVN and brands of imported fiberglass laminates FR-4, FR-5, CEM-3 having many modifications. For the manufacture of boards intended for operation in conditions of normal and high humidity at temperatures from -60 to +85 ° C, the SF brand is used, which has many types, one of them SF-1-35G.

Designations in the name SF-1-35G:

• SF - foil fiberglass laminate
• 1 - one-sided
• 35 - Foil thickness 35 microns
• G - galvanic resistant foil

To produce most electronic devices brand can be used SONF-U, its operating temperature is from -60 to +155 °C. Designations in the name: S and F – foil fiberglass, OH – general purpose, U - contains bromine-containing additive and belongs to the class of non-flammable plastics. The thickness of the foil placed on the base ranges from 18, 35, 50, 70, 105 microns. The thickness of foil fiberglass laminate is in the range from 0.5 to 3 mm.

FR-4 fire-resistant (Fire Retardent) imported foil fiberglass. FR-4 is by far the most common grade of material for the production of printed circuit boards. High technological and performance characteristics determined the popularity of this material.

FR-4 has nominal thickness 1.6 mm, lined with copper foil 35 microns thick on one or both sides. Standard FR-4 is 1.6 mm thick and consists of eight layers (“prepregs”) of fiberglass. The central layer usually contains the manufacturer's logo; its color reflects the flammability class of this material (red - UL94-VO, blue - UL94-HB). Typically, FR-4 is transparent, standard green color determined by the color of the solder mask applied to the finished PCB

• volumetric electrical resistance after conditioning and restoration (Ohm x m): 9.2 x 1013;
• surface electrical resistance (Ohm): 1.4 x1012;
• peeling strength of foil after exposure to galvanic solution (N/mm): 2.2;
• flammability (vertical test method): class Vо.

Single-sided foil fiberglass CEM-3. CEM-3 is an imported material (Composite Epoxy Material), most similar to foil-clad fiberglass laminate of the FR-4 brand, at a price 10-15% lower. It is a fiberglass base between two outer layers of fiberglass. Suitable for metallization of holes. CEM-3 is milky white or transparent material, very smooth. The material is easy to drill and stamp. In addition to foil PCB, many different materials are used to make boards.

Getinax

Single-sided foil getinaks.

Foil getinax is intended for the manufacture of boards intended to operate at normal air humidity with one- or two-sided installation of parts without metallization of holes. The technological difference between getinax and fiberglass laminate is the use of paper rather than fiberglass in its production. The material is cheap and easy to stamp. Has good electrical characteristics V normal conditions. The material has disadvantages: poor chemical resistance and poor heat resistance, hygroscopicity.

Domestic foil getinaks brands GF-1-35, GF-2-35, GF-1-50 and GF-2-50 designed to operate at a relative humidity of 45 - 76% and a temperature of 15 - 35 C°, the base material has Brown color. XPC, FR-1, FR-2 – imported foil getinaks. These materials have a base made of paper with a phenolic filler; the materials are easily stamped.

- FR-3– modification of FR-2, but epoxy resin is used as a filler instead of phenolic resin. The material is intended for the production of boards without metallization of holes.

- CEM-1– a material consisting of epoxy resin (Composite Epoxy Material) on a paper base with one layer of fiberglass. Designed for the production of circuit boards without metallization of holes; the material is easily stamped. Usually milky white or milky yellow in color.

Other foil materials are used for more severe operating conditions, but have more high price. Their base is made on the basis of chemical compounds that improve the properties of boards: ceramics, aramid, polyester, polyimide resin, bismaleinimide-triazine, cyanate ester, fluoroplastic.

PCB pad coatings

Let's look at what types of coatings there are for copper pads. Most often sites are covered tin-lead alloy, or POS. The method of applying and leveling the solder surface is called HAL or HASL(from English Hot Air Solder Leveling - leveling solder with hot air). This coating provides the best solderability of the pads. However, it is being replaced by more modern coatings, usually compatible with the requirements of the international directive RoHS. This directive requires the prohibition of the presence of harmful substances, including lead, in products. So far, RoHS does not apply to the territory of our country, but it is useful to remember its existence. HASL is used everywhere unless otherwise required. Immersion (chemical) gold plating is used to provide a smoother board surface (this is especially important for BGA pads), but has slightly lower solderability. Oven soldering is performed using approximately the same technology as HASL, but hand soldering requires the use of special fluxes. Organic coating, or OSP, protects the copper surface from oxidation. Its disadvantage is the short shelf life of solderability (less than 6 months). Immersion tin provides a smooth surface and good solderability, although it also has a limited solder life. Lead-free HAL has the same properties as lead-containing HAL, but the composition of the solder is approximately 99.8% tin and 0.2% additives. The contacts of the blade connectors, which are subject to friction during operation of the board, are electroplated with a thicker and more rigid layer of gold. For both types of gilding, a nickel underlayer is used to prevent diffusion of gold.

Protective and other types of printed circuit board coatings

To complete the picture, let’s consider the functional purpose and materials of printed circuit board coatings.

Solder mask - applied to the surface of the board to protect conductors from accidental short circuits and dirt, as well as to protect fiberglass from thermal shock during soldering. The mask does not carry any other functional load and cannot serve as protection against moisture, mold, breakdown, etc. (except when used special types masks).

Marking - applied to the board with paint over a mask to simplify identification of the board itself and the components located on it.

Peelable mask - applied to specified areas of the board that need to be temporarily protected, for example, from soldering. It is easy to remove in the future, since it is a rubber-like compound and simply peels off.

Carbon contact coating - applied to certain areas of the board as contact fields for keyboards. The coating has good conductivity, does not oxidize and is wear-resistant.

Graphite resistive elements - can be applied to the surface of the board to perform the function of resistors. Unfortunately, the accuracy of the denominations is low - no more accurate than ±20% (with laser adjustment - up to 5%).

Silver contact jumpers - can be applied as additional conductors, creating another conductive layer when there is not enough space for routing. Mainly used for single-layer and double-sided printed circuit boards.

The quality of supplied materials complies with the IPC4101B standard, and the manufacturers' quality management system is confirmed by international certificates ISO 9001:2000.

FR4 – fiberglass laminate with fire resistance class 94V-0 is the most common material for the production of printed circuit boards. Our company supplies the following types materials for the production of single- and double-sided printed circuit boards:

• Fiberglass laminate FR4 with a glass transition temperature of 135ºС, 140ºС and 170ºС for the production of single-sided and double-sided printed circuit boards. Thickness 0.5 - 3.0 mm with foil 12, 18, 35, 70, 105 microns.
• Basic FR4 for internal layers of MPP with glass transition temperatures of 135ºС, 140ºС and 170ºС
• FR4 prepregs with glass transition temperatures of 135ºС, 140ºС and 170ºС for pressing MPP
• Materials XPC, FR1, FR2, CEM-1, CEM-3, HA-50
• Materials for boards with controlled heat dissipation:
  • (aluminum, copper, stainless steel) with a dielectric with thermal conductivity from 1 W/m*K to 3 W/m*K produced by Totking and Zhejiang Huazheng New Material Co.
  • Material HA-30 CEM-3 with thermal conductivity 1 W/m*K for the production of single- and double-sided printed circuit boards.

For some purposes, a high-quality non-foil dielectric is required that has all the advantages of FR4 (good dielectric properties, stability of characteristics and dimensions, high resistance to adverse influences). climatic conditions). For these applications we can offer non-foil FR4 fiberglass laminate.

In many cases where fairly simple printed circuit boards are required (in the production of household equipment, various sensors, some components for automobiles, etc.), the excellent properties of fiberglass are redundant, and indicators of manufacturability and cost come to the fore. Here we can offer the following materials:

• XPC, FR1, FR2 - foil getinaks (base made of cellulose paper impregnated with phenolic resin), widely used in the manufacture of printed circuit boards for consumer electronics, audio and video equipment, in the automotive industry (arranged in ascending order of properties, and, accordingly, price ). Excellent stamping.
• CEM-1 is a laminate based on a composition of cellulose paper and fiberglass with epoxy resin. Stamps beautifully.

Our assortment also includes electrodeposited copper foil for pressing MPP produced by Kingboard. Foil is supplied in rolls of various widths, foil thicknesses are 12, 18, 35, 70, 105 microns, foil thicknesses of 18 and 35 microns are almost always available from our warehouse in Russia.

All materials are produced in accordance with the RoHS directive, the content of harmful substances is confirmed by relevant certificates and RoHS test reports. Also, all materials, many items have certificates, etc.

Base material – the main carrier of the mounting device and electronic circuits of the printed circuit board. The base material is supplied to the PCB manufacturer as a "panel" and cut to fit required size for the production of a specific board. There are many base materials for printed circuit boards with different thicknesses and coatings, as well as different electrical and mechanical properties, which affect the functionality of the electronic circuit. See also PP Materials. Often the base material is fiberglass with epoxy resin (FR4), available as copper foil or prepreg.

Getinax foil - compressed layers of electrical insulating paper impregnated with phenolic or epoxyphenolic resin as a binder, lined on one or both sides with copper foil.

Flexibility insulating material – is specified by the number of bending cycles around the mandrel, the diameter of which is equal to several values ​​of the thickness of the flexible section.

Hard gilding - Electrolytic hard gold plating is a friction-resistant surface used for gold leads. We electroplate nickel onto the copper trace. Gold is then applied to the nickel.

Rolled copper foil – has a relative elongation 5-6 times greater than that of electrolytic foil, therefore it has greater flexibility, bending ability, and also the ability to machining without delamination. Is expensive. Used in the production of flexible printed circuit boards.

PCB base material – material (dielectric) on which the printed circuit board design is made.

Unreinforced base materials - copper foil coated with resin with state B - partially polymerized resin or with state C - fully polymerized resin, as well as liquid dielectrics and dielectrics coated with a dry film.

Non-foil dielectrics There are two types. 1. With an adhesive layer, which is applied to increase the adhesion strength of copper deposited during the manufacturing process of PP chemically; 2. With a catalyst introduced into the volume of the dielectric, which promotes the deposition of chemical copper.

PCB with thick copper - usually a thick copper board is a printed circuit board with a copper thickness > 105µm. Such boards are used for high switching currents in automotive and industrial electronics and for specific client requests. Copper offers the highest thermal conductivity after silver.
Boards with a thick layer of copper allow you to:
High switching currents
Optimal heat transfer with local heating
Increased life, reliability and level of integration
However, when designing the board, special precautions must be taken regarding the etching process; only wider conductor structures are acceptable.

Prepregs – insulating cushioning material used for gluing layers of MPP. They are made of fiberglass impregnated with under-polymerized thermosetting epoxy or other resins.

SAF (prepreg with low viscosity, low flow prepreg) - an adhesive material with controlled fluidity, which is used in the manufacture of GZhP, has adhesion to both fiberglass and polyimide.

Gold connection - PCB surface Bond gold is a collective term for surfaces capable of bonding, usually gold surfaces. The following types of connections are used: nickel immersion gold (ENIG) for connecting aluminum wires (Al), soft gold with electrolytic coating for connecting gold wires (Au) and ENEPIG (nickel and palladium immersion gold), which is suitable for both connection methods .
The thickness of the gold layer for chemical (immersion) gilding is about 0.3-0.6µm, for electrolytic (soft) gilding about 1.0-2.0µm and about 0.05-0.1µm gold plus 0.05-0.15µm palladium for ENEPIG. The gold layers are based on approximately 3.0-6.0µm of nickel.

Foil fiberglass laminate – compressed layers of fiberglass impregnated with epoxyphenol or epoxy resin. Compared to getinax, it has better mechanical and electrical properties, higher heat resistance, and less moisture absorption.

Technological (consumable) materials for the manufacture of PP – photoresists, special screen paints, protective masks, electrolytes of copper plating, etching, etc.

Strengthened base materials and prepregs – non-woven glass materials developed specifically for laser technology with a given filament geometry and a given filament distribution (flat side in the Z-axis direction), organic materials with a non-oriented arrangement of fibers (aramid), prepreg for laser technology, standard structures based on glass fabric, etc.

Foil dielectrics – consist of fiberglass made from threads; resin used to impregnate fiberglass; foil used as metal coating foil materials.

Foil and non-foil polyimide – used in electronic equipment responsible appointment, operating at high temperatures, for the manufacture of flexible printed circuit boards, GPCs, rigid-flex printed circuit boards, as well as multilayer printed circuit boards, integrated circuit carrier tapes, and large hybrid integrated circuits with up to 1000 pins.

Electrolytic Copper Foil – inexpensive; used in the manufacture of GPCs with a high density of conductor patterns. It has a higher resolution when etching copper from gaps compared to a katana.

CEM 1 is a base material for printed circuit boards made from multi-layer paper. CEM 1 has a core of epoxy resin impregnated paper and one outer layer of fiberglass. Due to the paper base, this material is not suitable for plating through holes. The material specification is contained in document IPC-4101.

IMDS – International Material Data System . IMDS (www.mdsystem.com) was developed by automobile manufacturers to capture the composition of materials used in automobiles, parts, devices, and systems to identify the individual material components of each vehicle or sub-group (eg, engine).
Since the entry into force of the ELV Directive (06/21/2003), automotive suppliers have been required to provide data on the ingredients of their products as part of the IMDS in order to determine the recovery rates available.
Must be registered in IMDS:
Printed circuit boards
Mounted PCBs
Components
ZVEI and the Automotive Industry have signed the document Assembly Material Data – Cooperation on Material Data Declaration:
Electronic Components and Systems Division and Printed Circuit Boards Division electronic systems ZVEI - the German Association of Electronic and Electrical Manufacturers has developed an effective concept for the declaration of material data electronic components and printed circuit boards. Data on materials should be obtained by forming cross-corporate product groups and standard values. These material data tables, called “umbrella” specifications, greatly simplify declarations without noticeable loss of accuracy. This concept has been successfully applied in the automotive industry since 2004.
To apply the Umbrella Specifications with the IMDS system, IMDS has issued Guideline 019, Printed Circuit Boards. These guidelines describe the method for entering the material content of printed circuit boards assembled.
Excerpt from Item 5: Standard Rules and Guidelines for E/E (PCB Component) from IMDS Recommendation 019: “PCB component data in IMDS, Umbrella Spec, IPC1752 or similar format is accepted if agreed between business partners.”
Umbrella specifications for IMDS developed by ZVEI with PCB manufacturers.
The dynamic program makes it easy to count the substances contained in a printed circuit board of any size. The surface and number of layers are freely selectable. Standard technologies are stored in a database.

RoHS - directive on the prohibition of harmful substances. This provision of European Union legislation states that electronic devices cannot contain lead or other harmful substances. For printed circuit boards, RoHS compliance is controlled by two components: the base material and the surface.

An electronic printed circuit board (Russian abbreviation - PP, English - PCB) is sheet panel, where interconnected microelectronic components are located. Printed circuit boards are used as part of various electronic technology, starting from simple residential calls, household radios, studio radios and ending with complex radar and computer systems. Technologically, the manufacture of electronics printed circuit boards involves the creation of connections with conductive “film” material. Such material is applied (“printed”) on an insulating plate, which is called a substrate.

Electronic printed circuit boards marked the beginning of the formation and development of electrical interconnection systems developed in the mid-19th century.

Metal strips (rods) were initially used as bulky electrical components, mounted on a wooden base.

Gradually, metal strips replaced conductors with screw terminal blocks. Wooden base also modernized, giving preference to metal.

This is what the prototype looked like modern production PP. Similar design solutions were used in the mid-19th century

The practice of using compact, small-sized electronic parts required unique solution on a basic basis. And so, in 1925, a certain Charles Ducasse (USA) found such a solution.

American engineer suggested unique way organizing electrical connections on an insulated plate. He used electrically conductive ink and a transfer stencil schematic diagram onto the plate.

A little later, in 1943, the Englishman Paul Eisler also patented the invention of etching conductive circuits on copper foil. The engineer used an insulator plate laminated with foil material.

However, the active use of Eisler technology was noted only in the period 1950-60, when they invented and mastered the production of microelectronic components - transistors.

The technology for manufacturing through holes on multilayer printed circuit boards was patented by Hazeltyne (USA) in 1961.

Thus, thanks to the increase in the density of electronic parts and the close arrangement of connecting lines, the new era PCB design.

Electronic printed circuit board - manufacturing

A generalized vision of the process: individual electronic parts are distributed over the entire area of ​​the insulating substrate. The installed components are then connected by soldering to the circuit circuits.

The so-called contact “fingers” (pins) are located along the extreme areas of the substrate and act as system connectors.

Through contact “fingers”, communication with peripheral printed circuit boards or connection of external control circuits is organized. The electronic printed circuit board is designed for wiring a circuit that supports one function or several functions simultaneously.

Three types of electronic printed circuit boards are manufactured:

1. One-sided.
2. Double-sided.
3. Multilayer.

Single-sided printed circuit boards are characterized by the placement of parts exclusively on one side. If the complete circuit parts do not fit on a single-sided board, a double-sided option is used.

Substrate material

The substrate traditionally used in printed circuit boards is typically made from fiberglass combined with epoxy resin. The substrate is covered with copper foil on one or two sides.

Electronics printed circuit boards made from phenolic resin paper, also coated with copper film, are considered cost-effective for production. Therefore, more often than other variations, they are used to equip household electronic equipment.

The connections are made by coating or by etching the copper surface of the substrate. Copper tracks are coated with a tin-lead composition to protect against corrosion. Contact pins on printed circuit boards are coated with a layer of tin, then nickel, and finally gold.

Performing strapping operations

Surface mounting technology involves the use of straight (J-shaped) or angled (L-shaped) branches. Due to such branches, each electronic part is directly connected to a printed circuit.

By using a complex paste (glue + flux + solder), electronic parts are temporarily held at the point of contact. The hold continues until the printed circuit board is inserted into the oven. There the solder melts and connects the circuit parts.

Despite the challenges of component placement, surface mount technology has another important advantage.

This technique eliminates the lengthy drilling process and insertion of bonding gaskets, as is practiced with the outdated through-hole method. However, both technologies continue to be actively used.

Electronic PCB Design

Each individual electronics printed circuit board (batch of boards) is designed for unique functionality. Electronic printed circuit board designers turn to design systems and specialized “software” to layout the circuit on a printed circuit board.

The gap between conductive tracks is usually measured in values ​​of no more than 1 mm. Hole locations for component conductors or contact points are calculated.

All this information is translated into the computer software format that controls drilling machine. An automatic machine for the production of electronic printed circuit boards is programmed in the same way.

Once the circuit diagram is laid out, a negative image of the circuit (mask) is transferred to a transparent sheet of plastic. Areas of the negative image that are not included in the circuit image are marked in black, and the circuit itself remains transparent.

Industrial manufacturing of electronics printed circuit boards

Electronics printed circuit board manufacturing technologies provide for production conditions in a clean environment. Atmosphere and objects production premises are automatically controlled for the presence of contamination.

Many electronic printed circuit board manufacturing companies practice unique manufacturing. And in standard form, the production of double-sided printing electronic board traditionally involves the following steps:

Making the base

1. The fiberglass is taken and passed through the process module.
2. Impregnated with epoxy resin (immersion, spraying).
3. The glass fiber is rolled on a machine to the desired thickness of the substrate.
4. Dry the substrate in an oven and place it on large panels.
5. The panels are arranged in stacks, alternating with copper foil and a backing coated with glue.

Finally, the stacks are placed under a press, where at a temperature of 170°C and a pressure of 700 kg/mm ​​2, they are pressed for 1-2 hours. Epoxy resin hardens, the copper foil is bonded under pressure to the substrate material.

Drilling and tinning holes

1. Several backing panels are taken, laid one on top of the other, and firmly fixed.
2. The folded stack is placed in a CNC machine, where holes are drilled according to the schematic pattern.
3. The holes made are cleared of excess material.
4. The internal surfaces of the conductive holes are coated with copper.
5. Non-conductive holes are left uncoated.

Producing a drawing of a printed circuit board

A sample PCB circuit is created using an additive or subtractive principle. In the case of the additive option, the substrate is coated with copper according to the desired pattern. In this case, the part outside the scheme remains unprocessed.

The subtractive process primarily covers the overall surface of the substrate. Then individual areas that are not included in the diagram are etched or cut out.

How does the additive process work?

The foil surface of the substrate is pre-degreased. The panels go through a vacuum chamber. Due to the vacuum, the layer of positive photoresist material is tightly compressed over the entire foil area.

The positive material for photoresist is a polymer that has the ability to solubilize under ultraviolet radiation. Vacuum conditions eliminate any possible remaining air between the foil and the photoresist.

The circuit template is laid on top of the photoresist, after which the panels are exposed to intense ultraviolet light. Since the mask leaves areas of the circuit transparent, the photoresist at these points is exposed to UV radiation and dissolves.

Then the mask is removed and the panels are pollinated with an alkaline solution. This, a kind of developer, helps to dissolve the irradiated photoresist along the boundaries of the areas of the circuit design. Thus, the copper foil remains exposed on the surface of the substrate.

Next, the panels are galvanized with copper. Copper foil acts as a cathode during the galvanization process. Exposed areas are galvanized to a thickness of 0.02-0.05 mm. The areas remaining under the photoresist are not galvanized.

Copper traces are additionally coated with a tin-lead composition or other protective coating. These actions prevent oxidation of copper and create a resist for the next stage of production.

Unneeded photoresist is removed from the substrate using an acid solvent. The copper foil between the circuit design and the coating is exposed. Since the copper of the PCB circuit is protected by a tin-lead compound, the conductor here is not affected by acid.

Techniques for industrial manufacturing of electronic circuit boards